CoWoS(Chip-on-Wafer-on-Substrate)：CoWoS是一種整合生產技術，先將晶片通過Chip on Wafer(CoW)的封裝制程連接矽晶圓，再把CoW晶片與基板連接，整合成Chip-on-Wafer-on-Substrate。
- Application of CoWoS :
- AI
- Server
- Networking
- Characteristic of CoWoS :
- Ultra-high performance,
- SoC partition
- Very high memory bandwidth
- Wide envelope
- Strengths of CoWoS
- Fine RDL pitch & High TSV density Si interposer
- Fine pitch Micro-bump Assembly
- Fine gap Flip Chip underfill
- CoW warpage control
- Large die reliability
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