Wafer Level Packaging 晶圓級封裝
在傳統晶圓封裝中，是將成品晶圓切割成單个晶片，然後再進行黏合封裝。晶圓級封裝(WLP)，顧名思義，就是在晶片還在晶圓上的時候就對晶片進行封裝: 保護層可以黏接在晶圓的頂部或底部，然後連接電路，再將晶圓切成單個晶片。
In conventional packaging, the finished wafer is cut up, or diced, into individual chips, which are then bonded and encapsulated. Wafer-level packaging (WLP), as its name implies, involves packaging the die while it is still on the wafer: protective layers may be bonded to the top and/or bottom of the wafer, then electrical connections are prepared and the wafer is diced into individual chips.
晶化科技所研發生產多款晶圓級封裝材料，晶圓背面保護膜Wafer Protection Film系列產品具有多功能性，耐化性佳、可控制晶圓翹曲。
傳統封裝和晶圓級封裝的區別
參考資料: semiengineering
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