品化科技Applichem

熱固型 B Stage 黏著劑  (Dispensing Epoxy Paste)

產品型號: PJT-07

產品特性: 

-台灣自主研發

-適用於 IC/LED/MEMS/LCD...等的相關製程黏著固定用。

-操作簡易， 不溢流，特別適用於微小線路製程使。

-為一液型黏著劑，從冷凍櫃取出回溫後(約 1~1.5 小時)即可使用，不需再攪拌。

-可替代日本品牌產品

-High Reliability

-Proven Adhesive Technology

半導體關鍵材料自主化、半導體材料供應在地化

Application: 

WaferChem PJT-07 is epoxy paste with dual curing mechanism type applied to different interface bonding. One curing temperature is at 100 ℃, the other is at 160 ℃.

PJT-07 just needs short time for soft and hard bake. B-Stage has high stability (approximate 6 months at room temperature in aluminum foil bag packaging). PJT-07 can be suitable to various types of dispensing machines.

Example: 

https://www.applichem.com.tw/bstage-paste.html