品化科技Applichem

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雷射切割保護液LSP系列

LSP系列為透明可剝離保護劑，沾附性佳，乾燥後塗膜可剝離性優異，適用於塑膠，金屬，玻璃與陶瓷表面暫時保護,使用後可完全以熱水剝除無殘膠(SCUM)，不侵蝕底材維持優異剝離性。

適用範圍

適用於雷射加工製程中塑膠，金屬，玻璃與陶瓷表面 之暫時保護，以避免雷射過程中噴濺之粒子沾黏於工件表面；經熱水洗與烘烤製程後可完全剝除無殘膠。

Recommended use and restriction on use:

Water-soluble protective coating material. Protective coating material for laser dicing.

LD series

Water-soluble, non-corrosive protective coating materials which is designed specifically for the ultraviolet- and infra-red laser grooving process in Outsource-Semiconductor Assembly Technology (OSAT).

• Optimized formulation to prevent thermal adhesion of debris, materials peeling / de-lamination, or PI-burning on chips
   
• Improved lubricity during grooving process while leaving no ionic or organic contamination on die surface even after prolong hours of coating

新產品: 綠光雷射切割保護液

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