可少量 or 小包材出貨，歡迎學校和研究單位來電詢問!
雷射切割保護液LSP系列
LSP系列為透明可剝離保護劑，沾附性佳，乾燥後塗膜可剝離性優異，適用於塑膠，金屬，玻璃與陶瓷表面暫時保護,使用後可完全以熱水剝除無殘膠(SCUM)，不侵蝕底材維持優異剝離性。
適用範圍
適用於雷射加工製程中塑膠，金屬，玻璃與陶瓷表面 之暫時保護，以避免雷射過程中噴濺之粒子沾黏於工件表面；經熱水洗與烘烤製程後可完全剝除無殘膠。
Recommended use and restriction on use:
Water-soluble protective coating material. Protective coating material for laser dicing.
LD series
Water-soluble, non-corrosive protective coating materials which is designed specifically for the ultraviolet- and infra-red laser grooving process in Outsource-Semiconductor Assembly Technology (OSAT).
- Optimized formulation to prevent thermal adhesion of debris, materials peeling / de-lamination, or PI-burning on chips
- Improved lubricity during grooving process while leaving no ionic or organic contamination on die surface even after prolong hours of coating
新產品: 綠光雷射切割保護液
相關文章:
全站熱搜
留言列表
