Most of 3D-IC designs are very customized, in part because there is no standard way of packaging chips together today, and in part because there is a growing demand for chips that are optimized for specific applications. As a result, each one of these designs has its own unique set of challenges, these challenges need customized advanced packging material and equipment.
WaferChem Technology is the one in Taiwan that invests in the leader of 3D-IC packaging materials, hoping to promote the localization of semiconductor material supply chain in Taiwan.
https://www.applichem.com.tw/news-detail-3123475.html
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